Next-Generation Mobile
Trends at SMS Forum 2005
- Assets mobile industry leadership with six compelling solutions
in memory, system logic & display

Samsung Electronics Co., the leader in advanced semiconductor technology, delivered an extremely optimistic outlook on the market migration to mobile technology before 700 IT technology enablers at the second annual Samsung Mobile Solution Forum in the Westin Taipei Hotel in downtown Taipei on March 22.
Samsung, which plans to steadily increase its business and investments in the mobile marketplace, said it foresees dynamic growth in corporate and consumer mobile usage over the next decade.
The company predicted that, as the movement toward "mobile convergence" accelerates, key functions will merge introducing more user-optimized mobile applications, calling for more innovative advances in semiconductor technology.
President and CEO of Samsung Electronics' Semiconductor Business, Dr. Hwamg Chang-gyu, launched the one-day event with a keynote address spotlighting convergence trends in the mobile market.
"The concept of customization is now being widely adopted by wireless system developers in an increasing commitment to make electronic devices more user-friendly and convenient. Mobile and digital consumer markets will take the lead in user-friendly convergence with IT mobilization not far behind," Hwang predicted. "Samsung's mobile solutions will facilitate that convergence with a rapid pace of technological advancement in the areas of memory devices, system LSI semiconductors and flat panel LCD screens."
Heralding the emergence of a new IT paradigm, Samsung outlined several key trends and complimentary product development strategies that it is deploying to address upcoming mobile design challenges, before an audience of its peers in the PDA, mobile handset and original design manufacturers (ODM) sectors and other mobile-related market segments.
The company also announced several additions to its cadre of leading edge technology solutions.
Samsung Electronics Co. demonstrated the world's first 1Gigabit (Gb) mobile DRAM, and unveiled five other leading edge mobile technologies that underscore its leadership in driving innovation and efficiency within the mobile industry. The advancements announced included a System-in-Package (SiP) with a 300MHz mobile CPU, a 1Gigabit (Gb) NAND flash memory, a 256Megabit (Mb) mobile DRAM, a 260K color display driver IC (DDI) for active matrix OLEDs (organic light emitting diodes), a qVGA resolution one-chip DDI and a 2.5-inch qVGA TFT LCD for MP3 players. Samsung offers the widest range and some of the most advanced mobile technologies in the world.
The new technologies were previewed to nearly 700 industry executives at the 2nd Samsung Mobile Solution Forum, held here in the Westin Taipei Hotel.
Conference attendees were shown Samsung's new SiP the first package containing a 300MHz mobile CPU, a 1Gb NAND Flash memory and a 256Mb mobile DRAM. The high density, high-performance logic-CPU design will accommodate the increasingly large data processing and storage needs of portable game consoles, handsets, camcorders and personal data assistants (PDAs).
By combining memory and system LSI technology, Samsung is coupling proven components within advanced package technology to improve mobile system integration, reduce power consumption and minimize size limitations. SiPs also reduce interference between devices, adding significantly to system reliability.
Samsung displayed another major innovation at its Mobile Forum, a 1Gb mobile DRAM, the first one-gigabit memory device to be publicly exhibited.
The new 1Gb mobile DRAM will support higher data processing requirements in graphics-enhanced digital camcorders, while accommodating five megapixel and higher resolutions in digital still cameras.
The newly developed SDRAM operates at 664 megabytes per second and has been optimized to function at 1.8 volts in maximizing battery life through the use of Samsung proprietary partial array self refresh (PASR) and temperature compensated self refresh (TCSR) technologies.
Samsung's 260K color display driver IC (DDI) for AM OLEDs utilizes 0.25um process technology to reduce the size of the device to approximately 40 percent of leading competitive models. The DDI for AM OLED features a quarter common interchange format (qCIF, 176xRGBx240 pixel) along with a 1.8 volt power level.
With its new AM OLED application, Samsung now has developed the widest range of DDI technology from STN-, TFT-LCD and AM OLED.
Also at the conference, Samsung announced a high resolution quad video graphics array (qVGA, 240xRGBx320 pixel). The qVGA DDI device features a built-in timing controller IC, a source driver, a gate driver, 1.3Mb SRAM and a power supply circuit. This five-in-one-chip solution was designed using 0.18um process technology and utilizes micro-pad pitching technology.
In its final public unveiling at the Mobile Forum, Samsung previewed a TFT LCD for MP3 players. The new 2.5-inch panel is 2.5-inches features crisp QVGA display resolution. Samsung proprietary Vertical Alignment (VA) technology enables wide viewing angles for optimal viewing of music videos and other visual displays that accompany MP3 music files. nw