Display of Chip Technologies
About 500 firms showcase technologies on silicon wafers, nanotechnology devices

SEMICON, Korea 2005, the largest expositor dedicated to semiconductor and flat panel display manufacturing in Korea, took place Feb.2-4 in the Convention and Exhibition Center(COEX) in Seoul. The exposition was presented by SEMI.
SEMICON Korea 2005 featured 500 exhibiting companies occupying approximately 1,000 booths, showcasing the latest equipment, materials and services for the production of 300 mm silicon wafers, nanotechnology devices and FPD products. Capital spending by Korean chipmakers grew by more than 50 percent last year to $4.8 billion, accounting for about 14 percent of the world total, according to the recently released SEMI year-end consensus forecast. Additionally, Korean device makers spent about $2.9 billion on semiconductor materials in 2004.
"The interest and excitement being shown in SEMICON Korea 2005 is a reflection of the leadership position taken by Korean semiconductor and FPD companies in both in terms of capital investment and production output," said Lee Joo-hoon, president of SEMI Korea. In addition to the show floor exhibits, the exposition featured two days of technical and business programs. The SEMICON Korea STS(SEMI Technical Symposium), Feb. 2-3 included technical sessions on advanced lithography, dielectrics, metals, new materials and their processes, device technology, etching technology, contamination-free manufacturing and IC packaging. A SEMI market briefing was held Feb. 2 followed by a SEMI international standards seminar Feb. 3.
Other programs included a nanotechnology seminar held in cooperation with KANC(Korea Advanced Nano Fab Center) and a CMP technology workshop jointly organized by SEMI and Korea CMP UGM.
The SEMICON plenary talk was presented by C. Michael Garner of Intel Corp., addressing the topic of Materials Challenges in Future IC Technologies. nw

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